National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Sponsor: NISTInternal Deadline: 03/11/2024Institutional Submission Limit: 1Sponsor Deadline: 04/12/2024Program Website
This program seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. “Advanced packaging” refers to many chips with diverse functions assembled tightly together on a substrate in two or three dimensions at extremely fine dimensions. This method achieves function, performance, and power savings far greater than can be achieved with conventionally packaged chips on a printed circuit board. Projects are expected to include, but not necessarily be limited to, basic and applied research, substrate and demonstration device development and production, commercial viability and domestic manufacturing, integrated workforce education and training, and pilot-level substrate production.
The six priority research investment areas of the CHIPS NAPMP are:
• Materials and substrates
• Equipment, tools, and processes
• Power delivery and thermal management for advanced packaging assemblies
• Photonics and connectors that communicate with the outside world
• A chiplet ecosystem
• Co-design of multi-chiplet systems with automated tools
Mandatory Concept Paper: due April 12, 2024
For those invited: Full proposals due July 3, 2024
Submission Process
Limited submissions MUST be coordinated with the Office of the Vice President for Research.
If interested in applying for this opportunity, email a two-page project abstract, include at top the project title, PI, and list of key collaborators, as well as a 2-3 page CV/biosketch for the PI (SCiENcv preferred) by 5pm on the INTERNAL DEADLINE above to Julie Morris at jmorris@sc.edu.