An Interdisciplinary Approach 

Our research team spans multiple disciplines including material science, physics and chemistry, engineering, public health and technology transfer. This interdisciplinary team results in comprehensive research into extreme semiconductor chips. 

Real-Life Testing

Wiith our well-rounded research team and state-of-the-art facilities, we can carry out fundamental research into extreme semiconductor chip materials, develop chip prototypes and establish their advantages. This real-life testing will leave little unknown about the performance of these chips in extreme environments.  

Targeted research condition: Extreme temperatures, voltage and power

Focus of the institute: Conduct pioneering research into third-generation extreme semiconductor materials, develop new electronic and optical chips, design the chips' packaging technology and transfer the technology commercially

Research vision: Development of extreme semiconductor chip prototypes with performance levels far exceeding those currently in use

Areas of Focus

The institute's interdisciplinary, collaborative research areas work together to conduct comprehensive research into and development of third-generation extreme semiconductors.

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  Research Step 1: Materials and Testing in Harsh Environments

  The first step in the development of extreme semiconductor chips is the growth and characterization of semiconductor materials that can be used in chip fabrication. These materials are meticulously synthesized and characterized to ensure they can perform in a variety of extreme conditions.

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  Research Step 2: Semiconductor Chip Design and Fabrication

  This research step starts with designing the extreme chips which are then fabricated and tested to verify their operation in extreme environments. The result is the production of novel, next-generation electronic and optical chips.

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  Research Step 3: Chip Packaging and Circuits

  Once the extreme semiconductor materials and chips have been established, the final step is to package them in a form useful for use in circuits. The development of these circuits will allow for the extreme chips to be used in many different applications across industries.